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CVE-2019-14037 PUBLISHED CVSS 7.800000190734863 HIGH

Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130

EPSS 0.09% · 25.5th percentile

Risk Scores

CVSS v3.1
7.800000190734863
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
EPSS Score
0.09%
25.5th percentile

Affected Products

VendorProductVersions
qualcommsc8180x_firmware
qualcommsda845_firmware
qualcommmsm8996au_firmware
qualcommsxr1130_firmware
qualcommsda660_firmware
qualcommmdm9207c_firmware
qualcommsdx55_firmware
qualcommapq8098_firmware
qualcommqcs605_firmware
qualcommsdm845_firmware
qualcommapq8053_firmware
qualcommsdm636_firmware
qualcommsdm630_firmware
qualcommsdx20_firmware
qualcommsdm439_firmware
qualcommsm8150_firmware
qualcommmsm8905_firmware
qualcommsdm670_firmware
qualcommqcn7605_firmware
qualcommmsm8996_firmware

…and 12 more

Timeline

References

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