VDB
CVE-2019-2339
CVE-2019-2339
PUBLISHED
CVSS 7.800000190734863 HIGH
Out of bound access due to lack of check of whiltelist array size while reading the image elf segments. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, QCS605, SDA845, SDM670, SDM710, SDM845, SDM850, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130, SXR2130
EPSS 0.09% · 26.3th percentile
Risk Scores
CVSS 3.1
7.800000190734863
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
EPSS Score
0.09%
26.3th percentile
Affected Products
| Vendor | Product | Versions |
|---|---|---|
| qualcomm | sdm850_firmware | |
| qualcomm | sm8150_firmware | |
| qualcomm | sdx24_firmware | |
| qualcomm | qcs605_firmware | |
| qualcomm | sdm710_firmware | |
| qualcomm | sm6150_firmware | |
| qualcomm | sxr1130_firmware | |
| qualcomm | sdm845_firmware | |
| qualcomm | sdx55_firmware | |
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | * |
| qualcomm | qcs404_firmware | |
| qualcomm | sdm670_firmware | |
| qualcomm | sda845_firmware | |
| qualcomm | mdm9205_firmware | |
| qualcomm | sm7150_firmware | |
| qualcomm | sxr2130_firmware |
Exploit Intelligence
- https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin (circl)
- vulnerability_exploit_rules.yar (github-yara)
- vulnerability_exploit_rules.yar (github-yara)
- vulnerability_exploit_rules.yar (github-yara)
- vulnerability_exploit_rules.yar (github-yara)
Timeline
- Oct 8, 2019 CVE Published
- Apr 14, 2021 EPSS Score
- Jun 23, 2021 EPSS Score
- Aug 24, 2021 EPSS Score
- Oct 26, 2021 EPSS Score
- Dec 27, 2021 EPSS Score
- Feb 28, 2022 EPSS Score
- Apr 1, 2022 EPSS Score
- May 1, 2022 EPSS Score
- Jul 3, 2022 EPSS Score
- Sep 4, 2022 EPSS Score
- Nov 6, 2022 EPSS Score