VDB
CVE-2019-10625
CVE-2019-10625
PUBLISHED
CVSS 7.099999904632568 HIGH
Out of bound access in diag services when DCI command buffer reallocation is not done properly with required capacity in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8009, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCS605, Rennell, SC8180X, SDM429W, SDM710, SDX55, SM7150, SM8150
EPSS 0.04% · 13.5th percentile
Risk Scores
CVSS 3.1
7.099999904632568
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:H
EPSS Score
0.04%
13.5th percentile
Affected Products
| Vendor | Product | Versions |
|---|---|---|
| qualcomm | apq8009_firmware | |
| qualcomm | mdm9640_firmware | |
| qualcomm | sc8180x_firmware | |
| qualcomm | sdm429w_firmware | |
| qualcomm | sdx55_firmware | |
| qualcomm | apq8096au_firmware | |
| qualcomm | sm8150_firmware | |
| qualcomm | mdm9206_firmware | |
| qualcomm | sm7150_firmware | |
| qualcomm | mdm9607_firmware | |
| qualcomm | sdm710_firmware | |
| qualcomm | rennell_firmware | |
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | APQ8009, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCS605, Rennell, SC8180X, SDM429W, SDM710, SDX55, SM7150, SM8150 |
| qualcomm | mdm9650_firmware | |
| qualcomm | qcs605_firmware | |
| qualcomm | mdm9207c_firmware |
Timeline
- Apr 7, 2020 CVE Published
- Apr 14, 2021 EPSS Score
- Jun 23, 2021 EPSS Score
- Aug 24, 2021 EPSS Score
- Oct 26, 2021 EPSS Score
- Dec 27, 2021 EPSS Score
- Feb 28, 2022 EPSS Score
- Apr 1, 2022 EPSS Score
- May 1, 2022 EPSS Score
- Jul 3, 2022 EPSS Score
- Sep 4, 2022 EPSS Score
- Nov 6, 2022 EPSS Score