VDB
CVE-2016-2063
CVE-2016-2063
PUBLISHED
CVSS 7.800000190734863 HIGH
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
EPSS 0.07% · 20.4th percentile
Risk Scores
CVSS 3.1
7.800000190734863
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
EPSS Score
0.07%
20.4th percentile
Affected Products
| Vendor | Product | Versions |
|---|---|---|
| n/a | n/a | n/a |
| linux | linux_kernel | 3.0 |
Exploit Intelligence
Timeline
- Aug 7, 2016 CVE Published
- Feb 4, 2022 EPSS Score
- Mar 29, 2022 EPSS Score
- May 20, 2022 EPSS Score
- Jul 12, 2022 EPSS Score
- Sep 3, 2022 EPSS Score
- Oct 26, 2022 EPSS Score
- Dec 18, 2022 EPSS Score
- Feb 8, 2023 EPSS Score
- Mar 7, 2023 EPSS Score
- Apr 2, 2023 EPSS Score
- May 25, 2023 EPSS Score