VDB
BDU%3A2025-13125
BDU%3A2025-13125
PUBLISHED
CVSS 7.199999809265137 HIGH
Уязвимость микропрограммного обеспечения встраиваемых плат Qualcomm, связанная с возможностью использования памяти после освобождения, позволяющая нарушителю выполнить произвольный код
Risk Scores
CVSS 2.0
7.199999809265137
Affected Products
| Vendor | Product | Versions |
|---|---|---|
| Qualcomm Technologies Inc. | WCD9380, WSA8830, WSA8835, SA8770P, QCA6574AU, SA8775P, SA7775P, SA8620P, SA8650P, SRV1H, SRV1M, QCA6688AQ, FastConnect 6900, FastConnect 7800, WCD9370, WCN3950, WSA8810, QAM8255P, QAM8295P, QAM8650P, QAM8775P, QAMSRV1H, QAMSRV1M, QCA6595, QCA6595AU, QCA6696, QCA6698AQ, QCA6797AQ, SA6155P, SA7255P, SA8155P, SA8195P, SA8255P, SA8295P, SA9000P, WCD9375, SG4150P, Snapdragon 680 4G, Snapdragon 685 4G (SM6225-AD), Snapdragon 8 Gen 1 |
Timeline
- Oct 20, 2025 CVE Published