VDB
BDU%3A2023-08671
BDU%3A2023-08671
PUBLISHED
CVSS 7.800000190734863 HIGH
Уязвимость микропрограммного обеспечения встраиваемых плат Qualcomm, связанная с недостатками использования функции assert(), позволяющая нарушителю вызвать отказ в обслуживании
Risk Scores
CVSS 2.0
7.800000190734863
Affected Products
| Vendor | Product | Versions |
|---|---|---|
| Qualcomm Technologies Inc. | WCD9380, WSA8830, WSA8835, AR8035, Snapdragon 8 Gen 1 Mobile Platform, Snapdragon 888 5G Mobile Platform, Snapdragon 888+ 5G Mobile Platform (SM8350-AC), Snapdragon 4 Gen 1 Mobile Platform, Snapdragon 480+ 5G Mobile Platform (SM4350-AC), Snapdragon 695 5G Mobile Platform, Snapdragon 778G 5G Mobile Platform, Snapdragon 778G+ 5G Mobile Platform (SM7325-AE), Snapdragon 780G 5G Mobile Platform, Snapdragon 782G Mobile Platform (SM7325-AF), Snapdragon 7c+ Gen 3 Compute Platform, Snapdragon 8+ Gen 1 Mobile Platform, Snapdragon X65 5G Modem-RF System, Snapdragon X70 Modem-RF System, Qualcomm® Video Collaboration VC3 Platform, Snapdragon 8 Gen 2 Mobile Platform, Snapdragon 8+ Gen 2 Mobile Platform, FastConnect 6700, FastConnect 6900, FastConnect 7800, QCS4490, QCM4490, WCD9370, WCD9390, WCD9395, WCN3950, WCN6740, WSA8810, WSA8815, WSA8832, WSA8840, WSA8845, WSA8845H, QCA8081, QCA8337, QCM6490, QCM8550, QCN6024, QCN9024, QCS6490, QCS8550, SM8550P, WCD9375, WCD9385, WCN3988, FastConnect 6200, QCA6391, SD888, SM7315, SM7325P, Snapdragon 4 Gen 2 Mobile Platform, SDX57M |
Timeline
- Dec 14, 2023 CVE Published